Numerical Simulation of Void Closure Process at DD15/SC-4 Superalloys Interface during Hot Isostatic Pressing Diffusion Bonding
WAN Xin, TANG Tianxiang, LIU Jian, WANG Xuqing, PENG Zicao, CHEN Gaoqiang
Journal of Netshape Forming Engineering . 2026, (7): 1 -10 .  DOI: 10.3969/j.issn.1674-6457.2026.07.001

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