Numerical Simulation of Void Closure Process at DD15/SC-4 Superalloys Interface during Hot Isostatic Pressing Diffusion Bonding

WAN Xin; TANG Tianxiang; LIU Jian; WANG Xuqing; PENG Zicao; CHEN Gaoqiang

doi:10.3969/j.issn.1674-6457.2026.07.001

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Journal of Netshape Forming Engineering ›› 2026, Vol. 18 ›› Issue (7) : 1-10. DOI: 10.3969/j.issn.1674-6457.2026.07.001

Key Technologies for Precision Forming of High-end Energy and Aerospace Equipment Components

Numerical Simulation of Void Closure Process at DD15/SC-4 Superalloys Interface during Hot Isostatic Pressing Diffusion Bonding

WAN Xin¹, TANG Tianxiang¹, LIU Jian², WANG Xuqing², PENG Zicao², CHEN Gaoqiang^1,*

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Abstract

The work aims to analyze the effects of interface roughness, pressure, and temperature on the morphological evolution, as well as the stress and strain processes, of the diffusion bonding interface between dissimilar superalloys during hot isostatic pressing (HIP). With DD15 and SC-4 nickel-based superalloys as research objects, a series of 2D thermo-mechanical coupled finite element models featuring three distinct surface roughness characteristics (rough turning, finish turning, and finish turning & polishing) were established. The effects of roughness on interface evolution were analyzed. Furthermore, the effects of pressure (100 MPa and 40 MPa) and temperature (1 160, 1 180, and 1 200 ℃) on the bonding process and strain distribution were investigated. Validation against experimental data showed that the relative error in predicting the interface recrystallization width was only 8%, confirming the accuracy of the proposed model. At 1 180 ℃ and 100 MPa, all three roughness models achieved complete void closure. As the applied pressure decreased, varying degrees of residual voids appeared in all models; specifically, the peak stress on the DD15 side dropped from 30 MPa (at 100 MPa) to 15 MPa (at 40 MPa), representing a 50% reduction. When the temperature increased from 1 160 ℃ to 1 200 ℃, the peak equivalent plastic strain remained consistently at approximately 0.3. As the interface roughness decreases from rough turning to finish turning, the maximum equivalent plastic strain required for complete void closure decreases from 1.1 to 0.18. Under insufficient pressure, the limited extent of the plastic deformation zone causes material extrusion to be confined to the local contact areas of asperities, failing to effectively fill the residual gaps and resulting in residual voids of different degrees to three roughness models. While increasing the temperature reduces the deformation resistance of the materials and accelerates the interface closure process, the equivalent plastic strain distribution required for void closure remains nearly independent of temperature variations, provided the initial roughness is constant.

Key words

DD15 superalloys / SC-4 superalloys / hot isostatic pressing diffusion bonding / interface void closure / numerical simulation

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WAN Xin, TANG Tianxiang, LIU Jian, WANG Xuqing, PENG Zicao, CHEN Gaoqiang. Numerical Simulation of Void Closure Process at DD15/SC-4 Superalloys Interface during Hot Isostatic Pressing Diffusion Bonding[J]. Journal of Netshape Forming Engineering. 2026, 18(7): 1-10 https://doi.org/10.3969/j.issn.1674-6457.2026.07.001

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Funding

Independent Innovation Special Fund of Aero Engine Corporation of China; The National Natural Science Foundation of China (52175334); Tsinghua University Initiative Scientific Research Program