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中文
Effect of Cold Rolling on High-temperature Grain Growth and Direct Bonding Performance of Oxygen-free Copper for IGBT
LIU Yuan, LIN Zhilin, XU Cheng, ZHANG Qingke, SONG Zhenlun
Journal of Netshape Forming Engineering . 2026, (
2
): 236 -247 . DOI: 10.3969/j.issn.1674-6457.2026.02.022
