Effect of Cold Rolling on High-temperature Grain Growth and Direct Bonding Performance of Oxygen-free Copper for IGBT

LIU Yuan; LIN Zhilin; XU Cheng; ZHANG Qingke; SONG Zhenlun

doi:10.3969/j.issn.1674-6457.2026.02.022

PDF(32341 KB)

Journal of Netshape Forming Engineering ›› 2026, Vol. 18 ›› Issue (2) : 236-247. DOI: 10.3969/j.issn.1674-6457.2026.02.022

Copper Alloy Forming

Effect of Cold Rolling on High-temperature Grain Growth and Direct Bonding Performance of Oxygen-free Copper for IGBT

LIU Yuan, LIN Zhilin, XU Cheng^*, ZHANG Qingke, SONG Zhenlun

Author information +

History +

Abstract

The work aims to study the influence law of cold rolling deformation on the grain growth and direct bonding performance of high temperature oxygen-free copper for IGBT modules, so as to provide a cold rolling process reference for obtaining a controllable and uniform grain structure after high-temperature treatment. The microstructure of oxygen-free copper with different cold rolling deformation amounts as well as its microstructure after high-temperature treatment at 1 000 ℃ was characterized by metallographic and electron backscatter diffraction (EBSD) techniques to explore the relationship between grain boundary characteristics and grain orientation with grain size and distribution of oxygen-free copper subjected to high temperatures treatment. The direct-bonding performance of oxygen-free copper strip and ceramic composite at high temperatures was also investigated by simulating the direct bonding process. The results show that the effect of cold rolling deformation on the high-temperature grain growth of oxygen-free copper is mainly influenced by substructure, dislocation structure, and grain orientation of the material. With the increase of cold rolling deformation, the grain size of oxygen-free copper after high-temperature treatment increases first and then decreased, and the size distribution gradually becomes uniform. The simulated direct bonding performance evaluation shows that as the cold-rolling deformation increases, the bonding between oxygen-free copper and ceramic plates became tighter and the grain size was more uniform. When the cold rolling deformation exceeds 13%, a competitive mechanism is put forward for grain growth. As the deformation increases, the average grain size decreases and the size distribution becomes more uniform. After the samples with 57% rolling deformation are subject to simulated direct bonding, a relatively uniform grain structure with the smallest size is obtained.

Key words

cold rolling / oxygen-free copper / grain growth / microstructure / direct bonding

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations

LIU Yuan, LIN Zhilin, XU Cheng, ZHANG Qingke, SONG Zhenlun. Effect of Cold Rolling on High-temperature Grain Growth and Direct Bonding Performance of Oxygen-free Copper for IGBT[J]. Journal of Netshape Forming Engineering. 2026, 18(2): 236-247 https://doi.org/10.3969/j.issn.1674-6457.2026.02.022

References

[1] 袁孚胜. 铜及铜合金板带材的生产现状及发展趋势[J]. 有色冶金设计与研究, 2021, 42(2): 13-15.
[2] YUAN F S.Status Quo and Development Trend of Copper and Copper Alloy Plate & Strip Products[J]. Nonferrous Metals Engineering & Research, 2021, 42(2): 13-15.
[3] KAZEM M S, ABDULBAQI I M.Design of Induction Coil for Oxygen Free Copper Production[J]. Journal of Engineering and Sustainable Development, 2022, 25(4): 51-57.
[4] 朱亚丹, 田文斌, 齐林, 等. 退火温度对小变形拉拔Cu-0.08Ag合金组织性能的影响[J]. 精密成形工程, 2024, 16(6): 164-172.
[5] ZHU Y D, TIAN W B, QI L, et al.Effect of Annealing Temperature on Microstructure and Properties of Cu-0.08Ag Alloy with Small Deformation[J]. Journal of Netshape Forming Engineering, 2024, 16(6): 164-172.
[6] 曹建武, 罗宁胜, DELATTE P, 等. 碳化硅器件挑战现有封装技术[J]. 电子与封装, 2022, 22(2): 18-30.
[7] CAO J W, LUO N S, DELATTE P, et al.SiC Device to Challenge Existed Packaging Technologies[J]. Electronics & Packaging, 2022, 22(2): 18-30.
[8] HAN L B, LIANG L, CHEN D D, et al.Modeling and Analysis of Mesh Pattern Influences on DBC Thermal Cycling Reliability[J]. Microelectronics Reliability, 2020, 110: 113645.
[9] KANG H, SHARMA A, LEE J H, et al.Transient Liquid Phase Bonding of Silicon and Direct Bond Copper via Electroplating of Tin-Copper Interlayers for Power Device Applications[J]. Materials Research Express, 2021, 8(1): 016301.
[10] WANG B Y, WANG L L, MU W, et al.Thermal Performances and Annual Damages Comparison of MMC Using Reverse Conducting IGBT and Conventional IGBT Module[J]. IEEE Transactions on Power Electronics, 2021, 36(9): 9806-9825.
[11] HAN L B, LIANG L, KANG Y, et al.A Review of SiC IGBT: Models, Fabrications, Characteristics, and Applications[J]. IEEE Transactions on Power Electronics, 2021, 36(2): 2080-2093.
[12] KIM D, YAMAMOTO Y, NAGAO S, et al.Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining[J]. Micromachines, 2019, 10(11): 745.
[13] SALDANA C, KING A H, CHANDRASEKAR S.Thermal Stability and Strength of Deformation Microstructures in Pure Copper[J]. Acta Materialia, 2012, 60(10): 4107-4116.
[14] LIU D D, ZHANG Z Y, FENG J J, et al.Atomic-Level Flatness on Oxygen-Free Copper Surface in Lapping and Chemical Mechanical Polishing[J]. Nanoscale Advances, 2022, 4(20): 4263-4271.
[15] WANG M, JIANG Y B, LI Z, et al.Microstructure Evolution and Deformation Behaviour of Cu-10wt%Fe Alloy during Cold Rolling[J]. Materials Science and Engineering: A, 2021, 801: 140379.
[16] WERT J A, HUANG X X, WINTHER G, et al.Revealing Deformation Microstructures[J]. Materials Today, 2007, 10(9): 24-32.
[17] 马牧之, 李周, 肖柱, 等. 晶界工程处理对超微合金化无氧铜的组织结构与耐热性的影响[J]. 中国有色金属学报, 2022, 32(2): 386-395.
[18] MA M Z, LI Z, XIAO Z, et al.Effect of Grain Boundary Engineering Treatment on Microstructure and Thermal Stability of Ultra-Microalloyed Oxygen-Free Copper[J]. The Chinese Journal of Nonferrous Metals, 2022, 32(2): 386-395.
[19] 陈文博. 加工工艺及氧含量对石墨烯用压延铜箔的影响[D]. 郑州: 郑州大学, 2018: 44-51.
[20] CHEN W B.The Effects of Processing Technology and Oxygen Content on Rolled Copper Foil for the Manufacture of Graphene[D]. Zhengzhou: Zhengzhou University, 2018: 44-51.
[21] 谢功园, 王轶, 陈宇强, 等. 换向轧制对铜晶粒尺寸高温热稳定性的影响[J]. 材料导报, 2022, 36(18): 188-194.
[22] XIE G Y, WANG Y, CHEN Y Q, et al.Effect of Alternative Rolling on Grain Size Thermal Stability of Copper at High Temperature[J]. Materials Reports, 2022, 36(18): 188-194.
[23] 孙书琪, 王润梓, 苑光健, 等. 退火过程中均质和异质结构纯铜晶粒的生长[J]. 机械工程材料, 2021, 45(6): 62-69.
[24] SUN S Q, WANG R Z, YUAN G J, et al.Growth of Homogeneous and Heterogeneous Structural Pure Copper Grains during Annealing Process[J]. Materials for Mechanical Engineering, 2021, 45(6): 62-69.
[25] JIN S, HUANG M, KWON Y, et al.Colossal Grain Growth Yields Single-Crystal Metal Foils by Contact- Free Annealing[J]. Science, 2018, 362(6418): 1021-1025.
[26] KONKOVA T, MIRONOV S, KORZNIKOV A, et al.Annealing Behavior of Cryogenically-Rolled Copper[J]. Materials Science and Engineering: A, 2013, 585: 178-189.
[27] KUSAMA T, OMORI T, SAITO T, et al.Ultra-Large Single Crystals by Abnormal Grain Growth[J]. Nature Communications, 2017, 8: 354.
[28] KRILL C E, HOLM E A, DAKE J M, et al.Extreme Abnormal Grain Growth: Connecting Mechanisms to Microstructural Outcomes[J]. Annual Review of Materials Research, 2023, 53: 319-345.
[29] DREMOV V V, CHIRKOV P V, KARAVAEV A V.Molecular Dynamics Study of the Effect of Extended Ingrain
Defects on Grain Growth Kinetics in Nanocrystalline Copper[J]. Scientific Reports, 2021, 11: 934.
[30] YUAN Y, JIANG Y D, ZHOU J, et al.Influence of Grain Boundary Character Distribution and Random High Angle Grain Boundaries Networks on Intergranular Corrosion in High Purity Copper[J]. Materials Letters, 2019, 253: 424-426.
[31] 刘媛, 林志霖, 张青科, 等. 高纯铜带耐高温性能的研究进展[J]. 中国有色金属学报, 2024, 34(8): 2530-2546.
[32] LIU Y, LIN Z L, ZHANG Q K, et al.Research Progress on High Temperature Resistance of Electronic Copper Strips[J]. The Chinese Journal of Nonferrous Metals, 2024, 34(8): 2530-2546.
[33] VERMA S, KAMALAKSHI G, GURURAJAN M P, et al.Misorientation Development at Σ3 Boundaries in Pure Copper: Experiments and MD Simulations[J]. Metallurgical and Materials Transactions A, 2023, 54(7): 2656-2669.
[34] UNGÁR T, OTT S, SANDERS P G, et al. Dislocations, Grain Size and Planar Faults in Nanostructured Copper Determined by High Resolution X-Ray Diffraction and a New Procedure of Peak Profile Analysis[J]. Acta Materialia, 1998, 46(10): 3693-3699.
[35] STUKOWSKI A, MARKMANN J, WEISSMÜLLER J, et al. Atomistic Origin of Microstrain Broadening in Diffraction Data of Nanocrystalline Solids[J]. Acta Materialia, 2009, 57(5): 1648-1654.
[36] SAKAI T K, BELYAKOV A, KAIBYSHEV R, et al.Dynamic and Post-Dynamic Recrystallization under Hot, Cold and Severe Plastic Deformation Conditions[J]. Progress in Materials Science, 2014, 60: 130-207.
[37] DONG Z C, FEI X Y, FENG L, et al.Effects of Deformation and Applied Temperature on the Microstructure and Performance of Industrial Ultra-Thin Rolled Cu Foil[J]. Journal of Materials Research and Technology, 2023, 23: 4268-4279.
[38] FANG J Y, LI C F, LIU F, et al.Effects of Grain Orientation and Grain Size on Etching Behaviors of High-Strength and High-Conductivity Cu Alloy[J]. Materials Today Communications, 2024, 38: 108111.

Funding

The Ningbo Science and Technology Innovation 2025 Major Special Project (2021Z118); Henan and Chinese Academy of Sciences Transformation Project of Science and Technology Achievement (2023105); The Key Research and Development Program of Ningbo (2023Z100)