PDF(2502 KB)
Non-vacuum Diffusion Bonding Technology for TC4 Alloy Water-cooling Plates
YU Tanbo, HOU Rui, LU Zhen, JIANG Shaosong
Journal of Netshape Forming Engineering ›› 2026, Vol. 18 ›› Issue (9) : 73-79.
PDF(2502 KB)
PDF(2502 KB)
Non-vacuum Diffusion Bonding Technology for TC4 Alloy Water-cooling Plates
TC4 titanium alloy / diffusion bonding / non-vacuum process / water-cooling plate
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