Non-vacuum Diffusion Bonding Technology for TC4 Alloy Water-cooling Plates

YU Tanbo, HOU Rui, LU Zhen, JIANG Shaosong

Journal of Netshape Forming Engineering ›› 2026, Vol. 18 ›› Issue (9) : 73-79.

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Journal of Netshape Forming Engineering ›› 2026, Vol. 18 ›› Issue (9) : 73-79. DOI: 10.3969/j.issn.1674-6457.2026.09.008
Advanced Joining Technology

Non-vacuum Diffusion Bonding Technology for TC4 Alloy Water-cooling Plates

  • YU Tanbo1,2, HOU Rui1, LU Zhen1,*, JIANG Shaosong1
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Abstract

To address the challenge of fabricating large‑scale, complex internal‑flow‑channel TC4 titanium alloy water‑cooling plates in fields such as shipbuilding, where conventional vacuum hot‑pressing diffusion bonding equipment is limited by size and cannot achieve integral forming, the work aims to conduct a hot‑pressing diffusion bonding process under non‑vacuum conditions, proposing a high‑quality, high‑efficiency diffusion bonding method suitable for large titanium alloy water-cooling plate structures. A non‑vacuum diffusion bonding process based on “internal vacuum pumping+inert gas dynamic protection” was adopted. Firstly, small‑scale experiments under various temperatures and pressures were conducted to study the effect of process parameters on interfacial bonding rate and microstructure, thereby optimizing the process parameters. Subsequently, with a superplastic forming machine, the TC4 cover plate and base plate were sealed by welding, internally evacuated, and continuously protected by argon gas, followed by hot‑pressing diffusion bonding in a non‑vacuum furnace chamber. Finally, the formed component underwent dimensional inspection, air‑tightness and hydraulic pressure tests, and scanning electron microscopy (SEM) was employed to analyze the interfacial microstructure and evaluate the bonding quality. The optimal process parameters were determined as 900 ℃, 3.5 MPa, and 60 min, under which the bonding rate reached 99% with no defects at the interface, achieving complete metallurgical bonding. A TC4 water‑cooling plate with overall dimensions of 470 mm×395 mm and an average thickness of 28.14 mm was successfully fabricated under non‑vacuum conditions, with dimensional errors within ± 2 mm. The component passed both 0.5 MPa air‑tightness and 5.0 MPa hydraulic pressure tests without leakage, meeting the requirements for high‑pressure cyclic service. Microstructural analysis revealed complete disappearance of the original interface, sufficient atomic diffusion between the two materials, and a defect‑free interface region. By establishing a local vacuum and inert gas protective environment inside the flow channels, the non‑vacuum diffusion bonding process achieves interface quality comparable to that of vacuum diffusion bonding. This method effectively avoids interfacial micro‑cracks and oxidation defects caused by insufficient gas protection in the machined flow‑channel grooves during prolonged pressing in conventional vacuum hot‑pressing, thereby enhancing the integrity and service reliability of the joint. The process provides a feasible technical route for the efficient and stable manufacturing of large‑scale, complex titanium alloy cooling structures.

Key words

TC4 titanium alloy / diffusion bonding / non-vacuum process / water-cooling plate

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YU Tanbo, HOU Rui, LU Zhen, JIANG Shaosong. Non-vacuum Diffusion Bonding Technology for TC4 Alloy Water-cooling Plates[J]. Journal of Netshape Forming Engineering. 2026, 18(9): 73-79 https://doi.org/10.3969/j.issn.1674-6457.2026.09.008

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Funding

The National Natural Science Foundation of China (52175297)
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