Optimization of Inkjet Printing Process Parameters for Nano-silver Lines Based on RSM-NSGA II

SUN Jian; LIU Jiawang; SUN Yanhui; LYU Jingxiang; GOU Ning; SUN Yi; LI Chao

doi:10.3969/j.issn.1674-6457.2026.01.008

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Journal of Netshape Forming Engineering ›› 2026, Vol. 18 ›› Issue (1) : 76-86. DOI: 10.3969/j.issn.1674-6457.2026.01.008

Additive Manufacturing

Optimization of Inkjet Printing Process Parameters for Nano-silver Lines Based on RSM-NSGA II

SUN Jian¹, LIU Jiawang¹, SUN Yanhui^1,*, LYU Jingxiang¹, GOU Ning², SUN Yi², LI Chao²

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Abstract

To address the challenge of simultaneously optimizing the line width precision and electrical performance of nano-silver lines in non-vertical inkjet printing, the work aims to propose a process parameter control strategy, to reduce the line width and lower the resistance of nano-silver lines. With the line width and resistance of nano-silver lines in non-vertical inkjet printing as the research object, a multi-objective optimization model based on Response Surface Methodology (RSM) and the Non-dominated Sorting Genetic Algorithm II (NSGA-II) was constructed. Through Box-Behnken experimental design, the nonlinear effect mechanisms of key parameters such as substrate temperature, printing speed, and printing layers on the line width and resistance were systematically investigated. A second-order polynomial regression model was established to characterize the parameter-performance mapping relationship, and the NSGA-II algorithm was employed to search for the Pareto optimal solution set, achieving dual-objective optimization of line width and resistance. The optimal process parameter combination obtained by NSGA-II algorithm optimization was as follows: a substrate temperature of 120 ℃, 5 printing layers, and a printing speed of 6.25 mm/s. Under these conditions, the predicted results for the nano-silver lines were a line width of 99.439 μm and a resistance of 15.754 Ω. Experimental validation results showed a line width of 97.403 μm and a resistance of 13.6 Ω, with deviations of 2.04% and 7.32%, respectively, both below 10%. Furthermore, by comparing the optimized group with the empirical group on substrates with different inclination angles, the optimized group exhibited significantly better performance in line width (reduction rate of 2.26%-14.66%) and resistance (reduction rate of 0.8%-20.45%), along with more uniform surface morphology. The optimized model based on RSM-NSGA II effectively achieves multi-objective optimization of electrical performance and geometric precision of nano-silver lines in non-vertical inkjet printing, providing theoretical support for the high-precision forming of complex curved organic substrates.

Key words

inkjet printing / nano-silver lines / response surface methodology / multi-objective optimization / process parameter optimization

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SUN Jian, LIU Jiawang, SUN Yanhui, LYU Jingxiang, GOU Ning, SUN Yi, LI Chao. Optimization of Inkjet Printing Process Parameters for Nano-silver Lines Based on RSM-NSGA II[J]. Journal of Netshape Forming Engineering. 2026, 18(1): 76-86 https://doi.org/10.3969/j.issn.1674-6457.2026.01.008

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Funding

National Key Research and Development Program of China (2022YFB4602800); Xi'an Municipal Science and Technology Plan Critical Core Technology Research Project for Key Industrial Chains (23LLRH0079)