Effect of Al Addition on Microstructure and Mechanical Properties of Sn-9Zn-3Bi Solder

CHEN Si; TU Wenbin; HU Zhihua; HU Jinyang; WANG Shanlin; CHEN Yuhua

doi:10.3969/j.issn.1674-6457.2025.08.007

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Journal of Netshape Forming Engineering ›› 2025, Vol. 17 ›› Issue (8) : 60-67. DOI: 10.3969/j.issn.1674-6457.2025.08.007

Light Alloy Forming

Effect of Al Addition on Microstructure and Mechanical Properties of Sn-9Zn-3Bi Solder

CHEN Si¹, TU Wenbin^1,*, HU Zhihua², HU Jinyang¹, WANG Shanlin¹, CHEN Yuhua¹

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Abstract

The work aims to study the effects of different Al contents on the melting characteristics, wettability, antioxidant property, microstructure and hardness of Sn-9Zn-3Bi lead-free solder. A DSC200F3 differential scanning calorimeter was used to test relevant melting characteristics of Sn-9Zn-3Bi-xAl (x=0, 0.05, 0.1, 0.15) and then observe the wettability and microstructure morphology of the solder joints by Phenom XL scanning electron microscope (SEM) and energy dispersive spectrometer (EDS) system; Finally, the antioxidant property and hardness of Sn-9Zn-3Bi-xAl (x=0, 0.05, 0.1, 0.15) were measured by thermogravimetric analyzer and Vickers hardness tester. Adding a trace amount of Al had no effect on the melting point of the solder, but would increase the melting range and undercooling degree. The melting range and undercooling degree first increased and then decreased with the increasing Al content, while the wetting angle continuously decreased. When 0.05% Al was added, the weight gain of the solder was obvious. With the increase of Al content, the high-temperature weight gain of the solder gradually decreased. After adding a trace amount of Al, the coarse needle-like Zn-rich phases in the microstructure of Sn-9Zn-3Bi solder became fine and more evenly distributed. With the addition of Al, the melting performance of the solder is reduced, but the undercooling degree is increased, which refines the microstructure of the solder and improves the hardness. With the increase of Al content, the wettability of the solder is improved. When 0.05% of Al is added, the antioxidant property of the solder is reduced, and with the increase of Al content, the antioxidant property of the solder is improved.

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Al addition / Sn-9Zn-3Bi solder / microstructure / mechanical properties / microstructural refinement

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CHEN Si, TU Wenbin, HU Zhihua, HU Jinyang, WANG Shanlin, CHEN Yuhua. Effect of Al Addition on Microstructure and Mechanical Properties of Sn-9Zn-3Bi Solder[J]. Journal of Netshape Forming Engineering. 2025, 17(8): 60-67 https://doi.org/10.3969/j.issn.1674-6457.2025.08.007

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