
Preparation Technology, Application Status, and Development Trends of Copper-clad Aluminum Laminated Materials
LIU Yujiang, DU Wenyu, WANG Yan, ZHOU Yisong, HU Hongjun, YI Zhihao, WANG Xingdong, ZHONG Tao
Journal of Netshape Forming Engineering ›› 2025, Vol. 17 ›› Issue (7) : 119-137.
Preparation Technology, Application Status, and Development Trends of Copper-clad Aluminum Laminated Materials
copper-clad aluminum laminated materials / preparation technology / interface bonding / application fields / development trends
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