基于压电阀非法向打印介电层成形质量预测和工艺参数协同优化

张子建, 郭奕博, 刘清涛, 薛增辉, 王庆, 尹恩怀

精密成形工程 ›› 2026, Vol. 18 ›› Issue (10) : 255-265.

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精密成形工程 ›› 2026, Vol. 18 ›› Issue (10) : 255-265. DOI: 10.3969/j.issn.1674-6457.2026.10.025
先进制造技术与装备

基于压电阀非法向打印介电层成形质量预测和工艺参数协同优化

  • 张子建1, 郭奕博1, 刘清涛1, 薛增辉2, 王庆2, 尹恩怀2,3,*
作者信息 +

Prediction of Forming Quality and Synergistic Optimization of Process Parameters of Dielectric Layers Fabricated by Piezoelectric Valve Based Non-normal Printing

  • ZHANG Zijian1, GUO Yibo1, LIU Qingtao1, XUE Zenghui2, WANG Qing2, YIN Enhuai2,3,*
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文章历史 +

摘要

目的 针对压电阀非法向打印过程中介电层在倾斜基板上易出现表面粗糙度增大、厚度分布不均等问题,提出一种面向介电层成形质量的工艺参数协同优化方法,以提升介电层表面质量与厚度均匀性。方法 以基板斜率、延迟时间、打印层数、线间距和打印速度为研究因素,以表面粗糙度和厚度均匀性为评价指标,首先通过正交试验筛选显著影响因素;在此基础上,采用响应面法(Response Surface Methodology,RSM)中的Box-Behnken试验设计建立双响应回归模型,并结合多目标进化算法(Multi-Objective Evolutionary Algorithm Based on Decomposition,MOEA/D)求解帕累托(Pareto)最优解集,进一步利用逼近理想解排序法(Technique for Order Preference by Similarity to Ideal Solution,TOPSIS)对非支配解进行综合排序,获得综合性能最优的工艺参数组合。结果 延迟时间、基板斜率和打印层数是影响非法向打印介电层表面粗糙度与厚度均匀性的显著因素。所建立的模型具有较高拟合精度,表面粗糙度模型和厚度均匀性模型的决定系数分别为0.991 5和0.998 8。经优化得到较优工艺参数组合如下:基板斜率16.69°、延迟时间11.32 ms、打印层数1,此时表面粗糙度为1.110 7 μm,厚度均匀性为1.641 9%。实验验证结果的平均值分别为1.182 6 μm和1.763 0%,相对误差分别为6.47%和7.38%,均小于10%。同时,通过工艺窗口分析确定了满足双响应要求的可行参数区域。结论 基于RSM-MOEA/D-TOPSIS的多目标优化方法可有效实现压电阀非法向打印介电层成形质量的协同优化,为复杂曲面电子器件介电层高质量制造提供了理论依据和工艺参考。

Abstract

To address the problems of increased surface roughness and non-uniform thickness distribution of dielectric layers during non-normal printing of piezoelectric valve based jetting on inclined substrates, the work aims to propose a synergistic process parameter optimization method for dielectric layer forming quality to improve surface quality and thickness uniformity. Substrate inclination angle, delay time, number of printed layers, line spacing, and printing speed were selected as the investigated factors, while surface roughness and thickness uniformity were taken as the evaluation indices. Significant affecting factors were first identified through an orthogonal experimental design. On this basis, dual-response regression models were established through the Box-Behnken design within Response Surface Methodology (RSM). The Pareto-optimal solution set was then obtained with the Multi-Objective Evolutionary Algorithm based on Decomposition (MOEA/D), and the non-dominated solutions were further ranked by the Technique for Order Preference by Similarity to Ideal Solution (TOPSIS) to determine the optimal process parameter combination for the best overall performance. Delay time, substrate inclination angle, and number of printed layers were identified as the significant factors affecting the surface roughness and thickness uniformity of dielectric layers fabricated by non-normal printing. The developed models showed high fitting accuracy, with coefficients of determination (R²) of 0.991 5 and 0.998 8 for the surface roughness model and thickness uniformity model, respectively. The optimized parameter combination was determined to be a substrate inclination angle of 16.69°, a delay time of 11.32 ms, and one printed layer, under which the surface roughness and thickness uniformity were 1.110 7 μm and 1.641 9%, respectively. Experimental validation yielded average values of 1.182 6 μm and 1.763 0%, with relative errors of 6.47% and 7.38%, respectively, both below 10%. In addition, process window analysis was conducted to identify the feasible parameter region satisfying the dual-response requirements. The multi-objective optimization method based on RSM-MOEA/D-TOPSIS can effectively achieve synergistic optimization of the forming quality of dielectric layers in piezoelectric valve based non-normal printing, providing a theoretical basis and process reference for the high-quality fabrication of dielectric layers in complex curved electronic devices.

关键词

非法向打印 / 压电阀打印 / 响应面法 / 多目标优化 / 多目标进化算法MOEA/D

Key words

non-normal printing / piezoelectric valve printing / response surface methodology / multi-objective optimization / multi-objective evolutionary algorithm based on decomposition (MOEA/D)

引用本文

导出引用
张子建, 郭奕博, 刘清涛, 薛增辉, 王庆, 尹恩怀. 基于压电阀非法向打印介电层成形质量预测和工艺参数协同优化[J]. 精密成形工程. 2026, 18(10): 255-265 https://doi.org/10.3969/j.issn.1674-6457.2026.10.025
ZHANG Zijian, GUO Yibo, LIU Qingtao, XUE Zenghui, WANG Qing, YIN Enhuai. Prediction of Forming Quality and Synergistic Optimization of Process Parameters of Dielectric Layers Fabricated by Piezoelectric Valve Based Non-normal Printing[J]. Journal of Netshape Forming Engineering. 2026, 18(10): 255-265 https://doi.org/10.3969/j.issn.1674-6457.2026.10.025
中图分类号: TN41   

参考文献

[1] 戈家影, 文钧民, 叶冬, 等. 飞行器智能蒙皮异质多层电路制造技术进展[J]. 航空制造技术, 2024, 67(13): 68-83.
GE J Y, WEN J M, YE D, et al.Advances in Manufacturing Technologies for Heterogeneous Multilayer Circuit of Aircraft Smart Skin[J]. Aeronautical Manufacturing Technology, 2024, 67(13): 68-83.
[2] 杨勇, 刘昊. 一种直升机超短波共形天线设计[J]. 中国科技信息, 2025(9): 25-28.
YANG Y, LIU H.Design of a Helicopter UHF Conformal Antenna[J]. China Science and Technology Information, 2025(9): 25-28.
[3] 胡长明, 谭良辰, 赵希芳, 等. 曲面共形天线研究现状与发展[J]. 电子机械工程, 2025, 41(3): 8-19.
HU C M, TAN L C, ZHAO X F, et al.Research Status and Development of Curved Conformal Antenna[J]. Electro-Mechanical Engineering, 2025, 41(3): 8-19.
[4] 林枝城, 加泽贤, 苟宁, 等. 基于压电喷墨打印技术的多层电路垂直互连工艺研究[J]. 工程设计学报, 2025, 32(6): 780-788.
LIN Z C, JIA Z X, GOU N, et al.Research on Vertical Interconnect Process of Multilayer Circuits Based on Piezoelectric Inkjet Printing Technology[J]. Chinese Journal of Engineering Design, 2025, 32(6): 780-788.
[5] 彭颐豫, 黎康杰, 陈昊璋, 等. 三维曲面贴片系统定位方法[J]. 电子工艺技术, 2026, 47(1): 14-16.
PENG Y Y, LI K J, CHEN H Z, et al.Positioning Method for 3D Curved Surface Bonding System[J]. Electronics Process Technology, 2026, 47(1): 14-16.
[6] HOBBIE H A, DOHERTY J L, SMITH B N, et al.Conformal Printed Electronics on Flexible Substrates and Inflatable Catheters Using Lathe-Based Aerosol Jet Printing[J]. npj Flexible Electronics, 2024, 8: 54.
[7] PEKKANEN V, MÄNTYSALO M, KAIJA K, et al. Utilizing Inkjet Printing to Fabricate Electrical Interconnections in a System-in-Package[J]. Microelectronic Engineering, 2010, 87(11): 2382-2390.
[8] YE S Z, LEI S Q, LIU X L, et al.Experimental Study of Droplet Evaporation on the Inclined Plane under the Periodically Varying Directional Electric Field[J]. Sensors and Actuators A: Physical, 2023, 360: 114551.
[9] DERBY B.Inkjet Printing of Functional and Structural Materials: Fluid Property Requirements, Feature Stability, and Resolution[J]. Annual Review of Materials Research, 2010, 40(1): 395-414.
[10] PARK J U, HARDY M, KANG S J, et al.High-Resolution Electrohydrodynamic Jet Printing[J]. Nature Materials, 2007, 6(10): 782-789.
[11] LI Y.Piezoelectric Jetting-based Additive Manufacturing for Flexible Electronics[J]. Journal of Manufacturing Processes, 2019, 45: 193-202.
[12] 胡建. 基于喷墨打印墨滴形成及铺展过程研究[D]. 常州: 常州大学, 2024: 18-48.
HU J.Study on Droplet Formation and Spreading Process Based on Inkjet Printing[D]. Changzhou: Changzhou University, 2024: 18-48.
[13] GAO Z J, DING X, SONG J F, et al.Analysis of the Dynamic Behavior of Droplet Impact on Inclined Surfaces[J]. Powder Technology, 2026, 476: 122397.
[14] ŠIKALO Š, TROPEA C, GANIĆ E N.Dynamic Wetting Angle of a Spreading Droplet[J]. Experimental Thermal and Fluid Science, 2005, 29(7): 795-802.
[15] CHEN R H, WANG H W.Effects of Tangential Speed on Low-Normal-Speed Liquid Drop Impact on a Non- Wettable Solid Surface[J]. Experiments in Fluids, 2005, 39(4): 754-760.
[16] FURIA G, GANZ F, CAIMMI A, et al.Use of a 6-axis Robot and Ink Piezo-jetting to Print Conductive Paths on 3D Objects[J]. Additive Manufacturing, 2021, 47: 102300.
[17] JIGNASU A, RURUP J D, SECOR E B, et al.Conformal Aerosol Jet Printing Using a 3-axis Printer[J]. Manufacturing Letters, 2023, 35: 523-528.
[18] RURUP J D, SECOR E B.Understanding Oblique Deposition in Aerosol Jet Printing for Conformal Electronics Fabrication[J]. Journal of Manufacturing Processes, 2024, 120: 1231-1240.
[19] MCKERRICHER G, VASEEM M, SHAMIM A.Fully Inkjet-Printed Microwave Passive Electronics[J]. Microsystems & Nanoengineering, 2017, 3: 16075.
[20] TEHRANI B K, MARIOTTI C, COOK B S, et al.Development, Characterization, and Processing of Thin and Thick Inkjet-Printed Dielectric Films[J]. Organic Electronics, 2016, 29: 135-141.
[21] GRADDAGE N, CHU T Y, DING H P, et al.Inkjet Printed Thin and Uniform Dielectrics for Capacitors and Organic Thin Film Transistors Enabled by the Coffee Ring Effect[J]. Organic Electronics, 2016, 29: 114-119.
[22] KIM M, NOH J, LEE C.Development of a Thickness Prediction Model for the Coffee-Staining Effect Based on the Ink Spreadability of a Tensioned Web[J]. Surfaces and Interfaces, 2025, 56: 104289.
[23] 秦国华, 王明明, 林锋. 基于TOPSIS和MOEA/D的装夹布局方案规划方法[J]. 计算机集成制造系统, 2023, 29(7): 2151-2165.
QIN G H, WANG M M, LIN F.Fixturing Layout Optimal Method Based on TOPSIS and MOEA/D[J]. Computer Integrated Manufacturing Systems, 2023, 29(7): 2151-2165.
[24] 刘森林, 胡光忠, 王平, 等. 基于RSM和MOEA/D- LWS的电极夹紧臂的多目标优化[J/OL]. 机械设计, 1-10[2026-04-08].https://doi.org/10.13841/j.cnki.jxsj.20251028.002.
LIU S L, HU G Z, WANG P, et al.Multi-objective Optimization of Electrode Clamping Arm Based on RSM and MOEA/D-LWS[J/OL]. Mechanical Design, 1-10 [2026-04-08].https://doi.org/10.13841/j.cnki.jxsj.20251028.002.
[25] ZHANG Q F, LI H.MOEA/D: A Multiobjective Evolutionary Algorithm Based on Decomposition[J]. IEEE Transactions on Evolutionary Computation, 2007, 11(6): 712-731.
[26] HWANG C L, YOON K.Multiple Attribute Decision Making: Methods and Applications[M]. Berlin; Heidelberg: Springer-Verlag, 1981: 58-191.

基金

工信部2025年产业基础再造和制造业高质量发展专项项目(2025ZY01014)

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