Zr35Ti30Cu7.5Be27.5块体非晶合金电脉冲连接的机理研究

杨洋; 杨辉; 吴建洲; 冯斌; 骆仁智; 刘平

doi:10.3969/j.issn.1674-6457.2026.09.019

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精密成形工程 ›› 2026, Vol. 18 ›› Issue (9) : 184-192. DOI: 10.3969/j.issn.1674-6457.2026.09.019

高熵合金和非晶合金成形

Zr₃₅Ti₃₀Cu_7.5Be_27.5块体非晶合金电脉冲连接的机理研究

杨洋^1,2, 杨辉¹, 吴建洲², 冯斌², 骆仁智², 刘平^2,*

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Mechanisms of Electropulsing Joining in Zr₃₅Ti₃₀Cu_7.5Be_27.5 Bulk Metallic Glass

YANG Yang^1,2, YANG Hui¹, WU Jianzhou², FENG Bin², LUO Renzhi², LIU Ping^2,*

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摘要

目的探究脉冲连接技术在大气下实现块体非晶合金毫秒级冶金结合的物理机制,并阐明接头截面元素富集特征的形成原因。方法以Zr₃₅Ti₃₀Cu_7.5Be_27.5非晶合金为研究对象,结合特征温度的加热速率依赖性分析与Vogel-Fulcher-Tammann（VFT）黏度流变模型,描述毫秒电脉冲条件下接头区黏度的时程变化规律;建立平行板力学模型,评估界面流动对表面氧化膜产生的膜内拉应力并描述其断裂行为;进一步引入基于有效电荷的电迁移模型,计算脉冲电流下Zr和Ti的电子风力方向与大小,并与界面元素分布进行关联分析。结果毫秒级电脉冲可使接头区域在极短时间内进入低黏度过冷液相状态,促使界面发生强烈流动。平行板流变模型表明,流动引起的氧化膜膜内拉应力为7.6~10.3 GPa,显著高于典型金属氧化物的断裂强度,从而导致氧化膜破裂,使得两侧母材实现原子层面的物理结合。电迁移分析结果进一步表明,Zr与Ti在脉冲电流作用下可能出现反向电迁移或者同向电迁移,但迁移强度存在数量级上的差异,从而形成接头截面处Zr、Ti元素的区域富集。结论在电脉冲连接过程中,快速加热诱导的过冷液相低黏度流动、界面应力驱动的氧化膜断裂以及脉冲电流下的元素电迁移三方面的协同作用,共同实现了快速冶金结合,本研究为深入理解非晶合金电脉冲连接机理及工艺优化提供了理论依据。

Abstract

The work aims to investigate the physical mechanism of millisecond-scale metallurgical bonding of the bulk metallic glass achieved by electropulsing joining technology under atmospheric conditions, and elucidate the formation mechanism for element enrichment characteristics at the joint cross-section. With Zr₃₅Ti₃₀Cu_7.5Be_27.5 metallic glass as the research object, the heating‑rate dependence of characteristic temperatures was combined with the Vogel-Fulcher-Tammann rheology model to describe the time-history evolution law of viscosity in the joint region under millisecond electropulsing conditions. A parallel‑plate mechanics model was established to evaluate the tensile stress within the oxide film induced by interfacial flow and describe its fracture behavior. Furthermore, an electromigration model based on effective charge was introduced to calculate the direction and magnitude of the electron wind force acting on Zr and Ti under pulsed current, followed by a correlation analysis with the elemental distribution at the interface. Millisecond electropulsing enabled the joint region to enter a low-viscosity supercooled liquid state within an extremely short time, triggering intense interfacial flow. The parallel-plate rheology model revealed that the tensile stress inside the oxide film induced by such flow ranged from 7.6 to 10.3 GPa, which was substantially higher than the fracture strength of typical metal oxides. This led to oxide film rupture and achieved atomic-scale physical joining between the base materials on both sides. Electromigration analysis further demonstrated that Zr and Ti might undergo either reverse or co-directional electromigration under pulsed current. The migration intensities differed by orders of magnitude, resulting in localized enrichment of Zr and Ti elements at the joint cross-section. During electropulsing joining, the synergistic effect of three factors, including low-viscosity flow of the supercooled liquid induced by rapid heating, oxide film fracture driven by interfacial stress, and elemental electromigration under pulsed current, collectively achieves rapid metallurgical joining. This work provides a theoretical basis for in-depth understanding of the electropulsing joining mechanism of amorphous alloys and process optimization.

导出引用

杨洋, 杨辉, 吴建洲, 冯斌, 骆仁智, 刘平. Zr₃₅Ti₃₀Cu_7.5Be_27.5块体非晶合金电脉冲连接的机理研究[J]. 精密成形工程. 2026, 18(9): 184-192 https://doi.org/10.3969/j.issn.1674-6457.2026.09.019

YANG Yang, YANG Hui, WU Jianzhou, FENG Bin, LUO Renzhi, LIU Ping. Mechanisms of Electropulsing Joining in Zr₃₅Ti₃₀Cu_7.5Be_27.5 Bulk Metallic Glass[J]. Journal of Netshape Forming Engineering. 2026, 18(9): 184-192 https://doi.org/10.3969/j.issn.1674-6457.2026.09.019

中图分类号： TG139.8 TG457

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