目的 针对新能源汽车继电器在容性负载时出现的黏接失效问题,探究渗碳工艺对CuCr25和CuCr40合金组织与抗黏接性能的影响。方法 采用球磨与放电等离子烧结相结合的方法制备CuCr合金,并通过真空渗碳技术进行表面改性;借助XRD、SEM、TEM等手段分析渗层的物相组成、微观组织及电弧侵蚀后的表面形貌;通过显微硬度仪、电导率测试仪与电接触测试平台,综合评估材料改性前后的硬度、导电性与抗黏接性能。结果 在CuCr25和CuCr40合金表面成功制备出纳米级Cr23C6渗碳层,厚度分别为7.516 μm、8.591 μm;渗碳层的形成有效提升了材料的表面硬度,电导率出现小幅下降。在750 V/1 500 A容性负载时,表面渗碳改性优化了CuCr合金的抗黏接性能。渗碳CuCr25表现出最优异的电寿命,其抗黏接次数从渗碳前的55次增至78次;而CuCr40的抗黏接性相对较差。渗碳层在触头闭合阶段发挥了显著的能量调节作用,使瞬时峰值功率降低约15%,并缩短了燃弧持续时间,从而大幅削弱了闭合过程中传递至接触界面的总热量。结论 渗碳工艺可以实现对CuCr合金的有效组织调控,且渗层能显著提升抗黏接性能。
Abstract
To address the bonding failure of new energy vehicle relays under capacitive loads, the work aims to investigate the effect of the carburizing process on the microstructure regulation and anti-bonding performance of CuCr25 and CuCr40 alloys. CuCr alloys were fabricated by ball milling combined with spark plasma sintering, and the as-prepared samples were then subjected to surface modification via vacuum carburizing. XRD, SEM and TEM were employed to characterize the phase composition, the microstructure of the carburized layer, and the surface morphology after arc erosion. A microhardness tester, an electrical conductivity meter and an electrical contact test platform were employed to systematically evaluate the hardness, electrical conductivity, and anti-bonding performance of the materials before and after modification. Nanoscale Cr23C6 carburized layers measuring 7.516 μm and 8.591 μm in thickness were successfully deposited on CuCr25 and CuCr40 alloy substrates, respectively. Carburizing treatment effectively improved the surface hardness, with a slight decrease in electrical conductivity observed. When subjected to a 750 V/1 500 A capacitive load, the carburized layer markedly enhanced the anti-bonding performance of the CuCr alloys. Specifically, carburized CuCr25 exhibited superior electrical contact life, with the number of anti-bonding cycles increasing from 55 to 78 after treatment. In contrast, CuCr40 showed relatively inferior anti-bonding performance. Mechanistically, the carburized layer exerted a pronounced arc-energy-regulation effect during the contact-closure arcing stage: the instantaneous peak power was reduced by approximately 15%, and the arcing duration was shortened, thereby substantially decreasing the total heat transferred to the contact interface during closure. This work reveals that the carburizing process achieves microstructure regulation of CuCr alloys, with the carburized layer significantly improving anti-bonding performance.
关键词
CuCr合金 /
表面渗碳 /
容性负载 /
抗黏接性能
Key words
CuCr alloys /
surface carburization /
capacitive load /
anti-bonding performance
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基金
徐州市可持续发展产业前瞻攻关项目（KC2025133）; 国家自然科学基金面上项目（52274401）; 重庆市自然科学基金面上项目（CSTB2023NSCQ-MSX0837）
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