目的 针对船舶等领域大尺寸、复杂内流道TC4钛合金水冷板组件在传统真空热压扩散连接设备中因尺寸受限而难以实现整体成形的难题,开展非真空环境下热压扩散连接工艺研究,旨在提出一种适用于大型钛合金水冷板结构的高质量、高效率扩散连接方法。方法 采用“内部抽真空+惰性气体动态保护”的非真空扩散连接工艺,首先通过小试样在不同温度与压力下的扩散连接实验,研究工艺参数对界面焊合率与微观组织的影响,优化工艺参数;在此基础上,基于超塑成形设备,对TC4盖板与底板进行密封焊接、内部抽真空与持续氩气保护,在非真空炉膛中进行热压扩散连接;最后对成形件进行尺寸检测、气密与液压试验,并利用扫描电镜（SEM）分析界面微观组织,评估连接质量。结果 获得的最佳工艺参数为900 ℃、3.5 MPa、60 min,此时焊合率达99%,界面无缺陷,实现完全冶金结合。在非真空环境下成功制备出外形尺寸为470 mm×395 mm、平均厚度为28.14 mm的TC4水冷板,尺寸误差在±2 mm以内;通过0.5 MPa气密与5.0 MPa液压试验后,组件均无渗漏,满足高压循环服役要求。微观组织显示连接界面完全消失,两侧材料原子扩散充分,界面区域无缺陷。结论 通过在流道内部建立局部真空与惰性气体保护环境,非真空扩散连接工艺实现了与真空扩散连接相当的高质量界面结合。该工艺有效避免了传统真空热压长时间压制过程中因流道铣槽区域气体保护不足而引发的界面微裂纹与氧化缺陷,从而提高了连接完整性与服役可靠性,为大型复杂钛合金冷却结构的高效、稳定制造提供了可行工艺路径。
Abstract
To address the challenge of fabricating large‑scale, complex internal‑flow‑channel TC4 titanium alloy water‑cooling plates in fields such as shipbuilding, where conventional vacuum hot‑pressing diffusion bonding equipment is limited by size and cannot achieve integral forming, the work aims to conduct a hot‑pressing diffusion bonding process under non‑vacuum conditions, proposing a high‑quality, high‑efficiency diffusion bonding method suitable for large titanium alloy water-cooling plate structures. A non‑vacuum diffusion bonding process based on “internal vacuum pumping+inert gas dynamic protection” was adopted. Firstly, small‑scale experiments under various temperatures and pressures were conducted to study the effect of process parameters on interfacial bonding rate and microstructure, thereby optimizing the process parameters. Subsequently, with a superplastic forming machine, the TC4 cover plate and base plate were sealed by welding, internally evacuated, and continuously protected by argon gas, followed by hot‑pressing diffusion bonding in a non‑vacuum furnace chamber. Finally, the formed component underwent dimensional inspection, air‑tightness and hydraulic pressure tests, and scanning electron microscopy (SEM) was employed to analyze the interfacial microstructure and evaluate the bonding quality. The optimal process parameters were determined as 900 ℃, 3.5 MPa, and 60 min, under which the bonding rate reached 99% with no defects at the interface, achieving complete metallurgical bonding. A TC4 water‑cooling plate with overall dimensions of 470 mm×395 mm and an average thickness of 28.14 mm was successfully fabricated under non‑vacuum conditions, with dimensional errors within ± 2 mm. The component passed both 0.5 MPa air‑tightness and 5.0 MPa hydraulic pressure tests without leakage, meeting the requirements for high‑pressure cyclic service. Microstructural analysis revealed complete disappearance of the original interface, sufficient atomic diffusion between the two materials, and a defect‑free interface region. By establishing a local vacuum and inert gas protective environment inside the flow channels, the non‑vacuum diffusion bonding process achieves interface quality comparable to that of vacuum diffusion bonding. This method effectively avoids interfacial micro‑cracks and oxidation defects caused by insufficient gas protection in the machined flow‑channel grooves during prolonged pressing in conventional vacuum hot‑pressing, thereby enhancing the integrity and service reliability of the joint. The process provides a feasible technical route for the efficient and stable manufacturing of large‑scale, complex titanium alloy cooling structures.
关键词
TC4钛合金 /
扩散连接 /
非真空工艺 /
水冷板
Key words
TC4 titanium alloy /
diffusion bonding /
non-vacuum process /
water-cooling plate
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