目的 探究自制Sn-Zn专用钎剂与树脂型钎剂、水溶性钎剂及ZnCl2-NH4Cl钎剂对Sn-Zn钎料润湿性、界面组织、接头力学性能及微焊点高温时效稳定性的影响规律与作用机制,为Sn-Zn钎料性能优化及专用钎剂研制提供理论依据。方法 通过正交试验筛选最优自制钎剂配方LF-8,采用润湿平衡法、接头力学性能测试、150 ℃高温时效微焊点力学性能测试、界面及断口形貌观察等手段,对比分析不同钎剂配合下Sn-Zn/Cu的润湿行为、力学性能演变、界面及断口形貌特征。结果 当配合LF-8钎剂时,Sn-Zn/Cu最大润湿力达4.67 mN,最短润湿时间为0.8 s,最大铺展面积为116.8 mm2,同时能显著细化界面组织;钎焊接头最大抗剪强度为39.06 MPa,最大抗拉强度为25.65 MPa,以树脂型、水溶性、ZnCl2-NH4Cl钎剂做对照,其抗拉强度分别提升111.11%、53.96%、27.49%,抗剪强度分别提升99.69%、76.18%、9.26%,接头断口韧窝更细小均匀;微焊点最大剪切力为86.46 N,最大拉伸力26.16 N,相较于3种对照钎剂,剪切力依次提升61.15%、41.71%、6.74%,拉伸力依次提升47.88%、30.93%、12.42%,且时效过程中衰减率最慢,可明显增强微焊点的力学性能及服役稳定性。结论 自制LF-8专用钎剂可有效提升Sn-Zn钎料润湿铺展能力、优化界面结构、大幅提高接头力学性能与高温时效稳定性,适用于Sn-Zn无铅钎料电子焊接领域。
Abstract
The work aims to investigate the effect law and action mechanism of self-developed special Sn-Zn flux, rosin-based flux, water-soluble flux, and ZnCl2-NH4Cl flux on the wettability, interfacial microstructure, joint mechanical properties, and high-temperature aging stability of Sn-Zn solder micro-joints, providing a theoretical basis for the performance optimization of Sn-Zn solder and the development of dedicated matching fluxes. The optimal formulation of self-prepared flux, namely LF-8, was screened through orthogonal tests. Based on the wetting balance method, joint mechanical property tests, mechanical performance tests of micro-joints after 150 ℃ high-temperature aging, as well as interfacial and fracture morphology observation, the wetting behavior, mechanical property evolution, and microscopic morphological characteristics of Sn-Zn/Cu soldering systems with different fluxes were comparatively analyzed. When LF-8 flux was applied to Sn-Zn/Cu solder, the maximum wetting force reached 4.67 mN, the minimum wetting time was 0.8 s, and the maximum spreading area was 116.8 mm2, which could significantly refine the interfacial microstructure. The maximum shear strength and tensile strength of the solder joints were 39.06 MPa and 25.65 MPa, respectively. Compared with joints prepared with rosin-based, water-soluble and ZnCl2-NH4Cl fluxes, the tensile strength increased by 111.11%, 53.96% and 27.49%, and the shear strength increased by 99.69%, 76.18% and 9.26%, with finer and more uniform dimples observed on the joint fracture surface. The maximum shear force and tensile force of micro-joints reached 86.46 N and 26.16 N, which increased by 61.15%, 41.71%, 6.74% and 47.88%, 30.93%, 12.42% respectively compared with the other three control fluxes, and the micro-joints exhibited the slowest attenuation during the aging process, remarkably improving the mechanical properties and service stability of micro-joints. In conclusion, the self-developed LF-8 special flux can effectively improve the wetting and spreading ability of Sn-Zn solder, optimize the interfacial structure, and significantly enhance the mechanical properties and high-temperature aging stability of solder joints, which is suitable for electronic welding applications of Sn-Zn lead-free solder.
关键词
Sn-Zn /
钎剂 /
润湿性能 /
力学性能 /
金属间化合物
Key words
Sn-Zn /
flux /
wetting ability /
mechanical properties /
intermetallic compounds
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基金
新型钎焊材料与技术国家重点实验室开放课题（SKLABFMT-2023-02）
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