目的 探究激光功率参数对开槽形貌的影响,实现对槽宽与槽深的精确控制。方法 在耦合双温模型与动网格技术的基础上,构建了皮秒脉冲激光加工晶圆铜和镍背金属层的三维热-力耦合模型,并系统开展了工艺参数研究,深入分析了激光功率、扫描速度与重复频率对温度场分布、残余应力状态及开槽形貌的影响规律。结果 激光功率对槽宽与槽深具有显著调控作用;在相同工艺参数下,相较于镍,铜加工后有更大的槽深与槽宽,且平均残余应力较低。而扫描速度对沟槽深度与成形质量影响显著,主要源于脉冲重叠率与扫描次数的变化：在较低扫描速度下,因同一位置经历多次激光烧蚀,槽深随时间的延长逐渐增大;当速度提升至600 mm/s以上时,槽深增长曲线趋于平滑,成形稳定性显著提高。此外,在100 kHz以下的低频条件下,沟槽出现不连续的未烧蚀区域;当频率超过100 kHz时,槽深波动幅度明显减小,成形质量趋于均匀稳定。结论 通过仿真与实验相结合,明确了关键激光工艺参数对晶圆背金激光开槽质量的影响规律,为实现高精度、高可靠性的晶圆开槽加工技术提供了理论依据与工艺支撑。
Abstract
The work aims to explore the influence of laser power parameters on the grooving morphology to achieve precise control of groove morphology. Based on the coupling of the two-temperature model and the dynamic mesh technique, a three-dimensional thermodynamics model for picosecond pulse laser grooving of Cu/Ni metal layers was established. A systematic process parameter investigation was conducted to analyze the influence of laser power, scanning speed, and repetition rate on the temperature field distribution, residual stress state, and groove morphology. Experimental results demonstrated that laser power significantly modulated both groove width and depth. Under identical process parameters, the Cu layer exhibited larger groove depth and width compared with the Ni layer, along with lower residual stress levels. Scanning speed notably affected groove depth and formation quality due to variations in pulse overlap and irradiation count. At lower speeds, repeated laser ablation at the same location led to a gradual increase in groove depth over time, whereas at speeds above 600 mm/s, the depth profile stabilized, and forming consistency improved significantly. Moreover, at repetition rates below 100 kHz, obvious discontinuous regions appeared in the groove, while at frequencies above 100 kHz, the depth curve became smooth with negligible fluctuations, resulting in uniform and stable formation quality. In conclusion, this study clarifies the influence mechanisms of key laser parameters on back-side metal laser grooving quality through simulation and experimentation, providing a theoretical foundation and technical support for high-precision and highly reliable wafer grooving processing techniques.
关键词
激光开槽 /
双温模型 /
皮秒激光 /
数值模拟 /
形貌调控
Key words
laser grooving /
two-temperature model /
picosecond laser /
numerical simulation /
morphological control
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基金
武汉市东湖高新区揭榜挂帅项目（2023KBJ214）
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