目的 分析不同界面粗糙度、压力以及温度对异质高温合金热等静压扩散连接界面形态演变以及应力应变过程的影响。方法 选取DD15和SC-4镍基高温合金作为研究对象,采用有限元法建立了具有3种不同表面粗糙度特征（粗车、精车、精车抛光）的二维热-力耦合有限元模型,分析了粗糙度对界面演变行为的影响。随后,探讨了压力（100 MPa、40 MPa）和温度（1 160、1 180、1 200 ℃）对界面焊合过程、应变分布的影响。结果 通过与实验结果进行对比可知,模拟预测的界面再结晶宽度相对误差仅为8%,验证了模型的准确性。在1 180 ℃、100 MPa条件下,3种粗糙度模型均实现孔洞闭合。随着施加压力的降低,3种粗糙度模型均出现不同程度的孔洞残留现象,并且DD15侧的峰值应力由30 MPa（压力100 MPa）下降至15 MPa（40 MPa）,下降了50%。随着温度从1 160 ℃升高至1 200 ℃,峰值等效塑性应变基本维持在0.3左右。结论 随着界面粗糙度由粗车降至精车抛光,孔洞完全闭合所需的最大等效塑性应变由1.1降至0.18。当压力不足时,由于塑性变形范围受限,材料仅在微凸体接触局部区域发生挤压,无法有效填充残余间隙,3种粗糙度模型均出现不同程度的孔洞残留现象。温度升高降低了材料的变形抗力,加快了界面闭合过程,但在焊前粗糙度不变时,孔洞闭合所需的等效塑性应变分布几乎不受温度变化影响。
Abstract
The work aims to analyze the effects of interface roughness, pressure, and temperature on the morphological evolution, as well as the stress and strain processes, of the diffusion bonding interface between dissimilar superalloys during hot isostatic pressing (HIP). With DD15 and SC-4 nickel-based superalloys as research objects, a series of 2D thermo-mechanical coupled finite element models featuring three distinct surface roughness characteristics (rough turning, finish turning, and finish turning & polishing) were established. The effects of roughness on interface evolution were analyzed. Furthermore, the effects of pressure (100 MPa and 40 MPa) and temperature (1 160, 1 180, and 1 200 ℃) on the bonding process and strain distribution were investigated. Validation against experimental data showed that the relative error in predicting the interface recrystallization width was only 8%, confirming the accuracy of the proposed model. At 1 180 ℃ and 100 MPa, all three roughness models achieved complete void closure. As the applied pressure decreased, varying degrees of residual voids appeared in all models; specifically, the peak stress on the DD15 side dropped from 30 MPa (at 100 MPa) to 15 MPa (at 40 MPa), representing a 50% reduction. When the temperature increased from 1 160 ℃ to 1 200 ℃, the peak equivalent plastic strain remained consistently at approximately 0.3. As the interface roughness decreases from rough turning to finish turning, the maximum equivalent plastic strain required for complete void closure decreases from 1.1 to 0.18. Under insufficient pressure, the limited extent of the plastic deformation zone causes material extrusion to be confined to the local contact areas of asperities, failing to effectively fill the residual gaps and resulting in residual voids of different degrees to three roughness models. While increasing the temperature reduces the deformation resistance of the materials and accelerates the interface closure process, the equivalent plastic strain distribution required for void closure remains nearly independent of temperature variations, provided the initial roughness is constant.
关键词
DD15高温合金 /
SC-4高温合金 /
热等静压扩散连接 /
界面孔洞闭合过程 /
数值模拟
Key words
DD15 superalloys /
SC-4 superalloys /
hot isostatic pressing diffusion bonding /
interface void closure /
numerical simulation
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基金
中国航空发动机集团有限公司自主创新专项资金; 国家自然科学基金（52175334）; 清华大学自主科研计划
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