冷轧对IGBT用无氧铜高温晶粒长大和覆铜烧结性能的影响

刘媛; 林志霖; 许赪; 张青科; 宋振纶

doi:10.3969/j.issn.1674-6457.2026.02.022

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精密成形工程 ›› 2026, Vol. 18 ›› Issue (2) : 236-247. DOI: 10.3969/j.issn.1674-6457.2026.02.022

铜合金成形

冷轧对IGBT用无氧铜高温晶粒长大和覆铜烧结性能的影响

刘媛, 林志霖, 许赪^*, 张青科, 宋振纶

作者信息 +

Effect of Cold Rolling on High-temperature Grain Growth and Direct Bonding Performance of Oxygen-free Copper for IGBT

LIU Yuan, LIN Zhilin, XU Cheng^*, ZHANG Qingke, SONG Zhenlun

Author information +

文章历史 +

摘要

目的基于IGBT模块对覆铜板用无氧铜的高温晶粒组织结构提出的要求,研究冷轧变形对IGBT用无氧铜高温下晶粒长大和覆铜烧结性能的影响规律,为获得高温处理后尺寸可控且均匀的晶粒结构提供冷轧工艺参考。方法利用金相和电子背散射衍射（EBSD）技术对不同冷轧变形量的无氧铜及其1 000 ℃高温处理后的组织结构进行表征,探讨晶界特征和晶粒取向与无氧铜高温下晶粒尺寸和分布的关系,并通过模拟覆铜烧结工艺考察不同冷轧变形量的无氧铜带和陶瓷板覆合烧结后的组织进而来考察覆铜烧结性能。结果冷轧变形对无氧铜高温晶粒长大的影响主要通过亚结构、位错结构和晶粒取向的变化来体现。随着冷轧变形量的增加,高温保温后无氧铜的晶粒尺寸先升高再降低,尺寸分布逐步均匀。模拟覆铜烧结结果表明,随着冷轧变形量增大,无氧铜与陶瓷板的结合愈加紧密,晶粒尺寸愈加均匀。结论当冷轧变形量大于13%时,晶粒长大形成竞争机制,随着变形量增加,晶粒平均尺寸变小,尺寸分布变均匀。57%轧制变形的样品经过模拟覆铜烧结后,获得了分布相对均匀且尺寸最小的晶粒组织。

Abstract

The work aims to study the influence law of cold rolling deformation on the grain growth and direct bonding performance of high temperature oxygen-free copper for IGBT modules, so as to provide a cold rolling process reference for obtaining a controllable and uniform grain structure after high-temperature treatment. The microstructure of oxygen-free copper with different cold rolling deformation amounts as well as its microstructure after high-temperature treatment at 1 000 ℃ was characterized by metallographic and electron backscatter diffraction (EBSD) techniques to explore the relationship between grain boundary characteristics and grain orientation with grain size and distribution of oxygen-free copper subjected to high temperatures treatment. The direct-bonding performance of oxygen-free copper strip and ceramic composite at high temperatures was also investigated by simulating the direct bonding process. The results show that the effect of cold rolling deformation on the high-temperature grain growth of oxygen-free copper is mainly influenced by substructure, dislocation structure, and grain orientation of the material. With the increase of cold rolling deformation, the grain size of oxygen-free copper after high-temperature treatment increases first and then decreased, and the size distribution gradually becomes uniform. The simulated direct bonding performance evaluation shows that as the cold-rolling deformation increases, the bonding between oxygen-free copper and ceramic plates became tighter and the grain size was more uniform. When the cold rolling deformation exceeds 13%, a competitive mechanism is put forward for grain growth. As the deformation increases, the average grain size decreases and the size distribution becomes more uniform. After the samples with 57% rolling deformation are subject to simulated direct bonding, a relatively uniform grain structure with the smallest size is obtained.

导出引用

刘媛, 林志霖, 许赪, 张青科, 宋振纶. 冷轧对IGBT用无氧铜高温晶粒长大和覆铜烧结性能的影响[J]. 精密成形工程. 2026, 18(2): 236-247 https://doi.org/10.3969/j.issn.1674-6457.2026.02.022

LIU Yuan, LIN Zhilin, XU Cheng, ZHANG Qingke, SONG Zhenlun. Effect of Cold Rolling on High-temperature Grain Growth and Direct Bonding Performance of Oxygen-free Copper for IGBT[J]. Journal of Netshape Forming Engineering. 2026, 18(2): 236-247 https://doi.org/10.3969/j.issn.1674-6457.2026.02.022

中图分类号： TG146.11

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