目的 采用微电铸技术在不锈钢基底上进行微混合器镍金属模具的制备,以满足对高载荷下长期高精度的使用要求。方法 为获得与镍铸层具有较高界面结合强度的金属基底,采用Materials Studio软件模拟了3种不锈钢基底（304、316和S136）与镍铸层的分离功。此外,采用电解刻蚀方法提高了镍铸层与S136不锈钢的界面结合强度,并通过实验对电解刻蚀参数进行了优选。通过垂直拉伸法验证了分子动力学求解分离功的可靠性,并测量了较优刻蚀参数下和未刻蚀时镍铸层与S136不锈钢间的界面结合强度。结果 S136不锈钢与镍铸层的分离功最大,界面结合强度最高,更适合作为微混合器镍金属模具的基底。通过分子动力学得到的3种不锈钢基底与镍铸层的分离功与实际的界面结合强度变化趋势相同。在刻蚀时间为60 s、刻蚀电压为10 V条件下,能获得合适的刻蚀深度、单边侧蚀量以及较大的表面粗糙度,该参数是提高界面结合强度的较优参数。刻蚀后镍铸层与S136不锈钢的界面结合强度为29.56 MPa,相较于未刻蚀时提高了218%。结论 基于以上仿真和实验结果,制备了满足要求的微混合器镍金属模具,其模芯高度为59.3~ 61.4 μm,最小线宽为60.2~61.5 μm。
Abstract
The work aims to employ micro-electroforming technology to fabricate a micromixer nickel metal mold on a stainless steel substrate, so as meet to the usage requirements for long-term, high-precision operation under high loads. To obtain a metal substrate with high interfacial bonding strength to the nickel electroforming layer, Materials Studio software was used to simulate the work of separation between three types of stainless steel substrates (304, 316, and S136) and the nickel electroforming layer. Additionally, electrolytic etching was employed to enhance the interfacial bonding strength between the nickel electroforming layer and S136 stainless steel, and experiments were conducted to optimize the electrolytic etching parameters. The reliability of molecular dynamics calculations for determining the work of separation was verified using the vertical tensile method. Additionally, the interfacial bonding strength between the nickel electroforming layer and S136 stainless steel was measured under optimal etching and unetched conditions. The results showed that S136 stainless steel had the highest work of separation with the nickel electroforming layer and the highest interfacial bonding strength, making it more suitable as a substrate for the micromixer nickel metal mold. The work of separation between the three types of stainless steel substrates and the nickel electroforming layer obtained through molecular dynamics simulations exhibited the same trend as the actual measured interfacial bonding strength. An etching time of 60 s and an etching voltage of 10 V were found to provide an appropriate etching depth, lateral erosion amount, and increased surface roughness, representing the optimal parameters for improving interfacial bonding strength. After etching, the interfacial bonding strength between the nickel electroforming layer and S136 stainless steel reached 29.56 MPa, an increase of 218% compared with the unetched condition. Based on the simulation and experimental results, a micromixer nickel metal mold that meets the requirements is successfully fabricated, with a core height of 59.3-61.4 μm and a minimum line width of 60.2-61.5 μm.
关键词
界面结合强度 /
微电铸 /
电解刻蚀 /
微混合器 /
分子动力学
Key words
interface bonding strength /
micro-electroforming /
electrolytic etching /
micromixer /
molecular dynamics
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基金
国家重点研发计划（2022YFB4601600）; 国家自然科学基金（52375561）
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