Al添加对Sn-9Zn-3Bi钎料显微组织及力学性能的影响

陈思; 涂文斌; 胡志华; 胡锦扬; 王善林; 陈玉华

doi:10.3969/j.issn.1674-6457.2025.08.007

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精密成形工程 ›› 2025, Vol. 17 ›› Issue (8) : 60-67. DOI: 10.3969/j.issn.1674-6457.2025.08.007

轻合金成形

Al添加对Sn-9Zn-3Bi钎料显微组织及力学性能的影响

陈思¹, 涂文斌^1,*, 胡志华², 胡锦扬¹, 王善林¹, 陈玉华¹

作者信息 +

Effect of Al Addition on Microstructure and Mechanical Properties of Sn-9Zn-3Bi Solder

CHEN Si¹, TU Wenbin^1,*, HU Zhihua², HU Jinyang¹, WANG Shanlin¹, CHEN Yuhua¹

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文章历史 +

摘要

目的研究不同Al含量对Sn-9Zn-3Bi无铅钎料熔化特性、润湿性、抗氧化性、显微组织及硬度的影响。方法采用DSC200F3差示扫描量热仪测试Sn-9Zn-3Bi-xAl（x=0、0.05、0.1、0.15）的相关熔化特性,再通过Phenom XL型扫描电镜（SEM）与能谱（EDS）系统观察该钎料焊点的润湿性与显微组织形貌;最后通过热重分析仪与维氏硬度计测量Sn-9Zn-3Bi-xAl（x=0、0.05、0.1、0.15）的抗氧化性与硬度。结果添加微量Al对钎料的熔点不产生影响,但会增加钎料的熔程和过冷度,熔程和过冷度随Al含量的增加呈现先升高后降低的规律,润湿角则不断降低;当加入0.05%（质量分数）的Al时,钎料增重明显,随着Al含量的增加,钎料高温增重逐渐降低;当添加微量Al后,Sn-9Zn-3Bi钎料显微组织中的粗大针状富Zn相变细小,且分布也更加均匀。结论随着Al的加入,钎料的熔化性能降低,但钎料的过冷度提高,使得钎料的显微组织被细化,提升了钎料的硬度;随着Al含量的增加,钎料的润湿性得到提高;当加入0.05%（质量分数）的Al时,钎料的抗氧化性最低,而随着Al含量增多,钎料的抗氧化性能得到提升。

Abstract

The work aims to study the effects of different Al contents on the melting characteristics, wettability, antioxidant property, microstructure and hardness of Sn-9Zn-3Bi lead-free solder. A DSC200F3 differential scanning calorimeter was used to test relevant melting characteristics of Sn-9Zn-3Bi-xAl (x=0, 0.05, 0.1, 0.15) and then observe the wettability and microstructure morphology of the solder joints by Phenom XL scanning electron microscope (SEM) and energy dispersive spectrometer (EDS) system; Finally, the antioxidant property and hardness of Sn-9Zn-3Bi-xAl (x=0, 0.05, 0.1, 0.15) were measured by thermogravimetric analyzer and Vickers hardness tester. Adding a trace amount of Al had no effect on the melting point of the solder, but would increase the melting range and undercooling degree. The melting range and undercooling degree first increased and then decreased with the increasing Al content, while the wetting angle continuously decreased. When 0.05% Al was added, the weight gain of the solder was obvious. With the increase of Al content, the high-temperature weight gain of the solder gradually decreased. After adding a trace amount of Al, the coarse needle-like Zn-rich phases in the microstructure of Sn-9Zn-3Bi solder became fine and more evenly distributed. With the addition of Al, the melting performance of the solder is reduced, but the undercooling degree is increased, which refines the microstructure of the solder and improves the hardness. With the increase of Al content, the wettability of the solder is improved. When 0.05% of Al is added, the antioxidant property of the solder is reduced, and with the increase of Al content, the antioxidant property of the solder is improved.

导出引用

陈思, 涂文斌, 胡志华, 胡锦扬, 王善林, 陈玉华. Al添加对Sn-9Zn-3Bi钎料显微组织及力学性能的影响[J]. 精密成形工程. 2025, 17(8): 60-67 https://doi.org/10.3969/j.issn.1674-6457.2025.08.007

CHEN Si, TU Wenbin, HU Zhihua, HU Jinyang, WANG Shanlin, CHEN Yuhua. Effect of Al Addition on Microstructure and Mechanical Properties of Sn-9Zn-3Bi Solder[J]. Journal of Netshape Forming Engineering. 2025, 17(8): 60-67 https://doi.org/10.3969/j.issn.1674-6457.2025.08.007

中图分类号： TG425

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