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| 电子封装用SiCp/6063复合材料的制备与性能研究 |
| Preparation and Properties of SiCp/6063 Composites for Electronic Packaging |
| Received:November 16, 2017 Revised:January 10, 2018 |
| DOI：10.3969/j.issn.1674-6457.2018.01.011 |
| 中文关键词: 复合材料 电子封装 碳化硅 热导率 |
| 英文关键词: composite material electronic packaging SiC thermal conductivity |
| 基金项目: |
| Author Name | Affiliation | | XIU Zi-yang | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China | | ZHANG Qiang | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China | | WANG Zi-ming | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China | | JIANG Han | State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China |
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| 中文摘要: |
| 目的 研究体积分数与热处理工艺对SiCp/6063复合材料热物理性能的影响规律，制备一种提高电子封装热管理能力的铝基复合材料。方法 采用挤压铸造法制备体积分数分别为55%, 60%, 65%的SiCp/6063复合材料，对不同体积分数的铝基复合材料分别进行热处理，比较复合材料在压铸态、退火态和T6时效处理态的性能差异。结果 碳化硅颗粒均匀地分布在铝基体中，碳化硅和铝的结合良好，组织致密，没有微小的空洞和明显的缺陷。SiCp/6063复合材料在20~50 ℃的温度区间内，其平均热膨胀系数约在10×10−6~13×10−6 ℃−1，导热系数为200~220 W/(m•K)，已经基本满足电子封装基板材料的性能要求。结论 随着温度的升高，复合材料的热膨胀系数呈先增加后短暂回落再增加的趋势；复合材料的热膨胀系数随着增强体体积分数的增加而减小；退火处理后SiCp/6063复合材料的热导率明显增加。 |
| 英文摘要: |
| The paper aims to study influences of volume fraction and heat treatment process on thermo physical properties of SiCp/6063 composite, and to prepare an aluminum matrix composite for improving the thermal management ability of electronic packaging. SiCp/6063 composites with volume fractions of 55%, 60% and 65% were prepared by squeeze casting. Heat treatment of aluminum matrix composites with different volume fraction was carried out to compare the performance differences of the composite in the die casting, annealed and T6 aging treatments. SiC particles were uniformly distributed in the aluminum matrix, and the silicon carbide and aluminum had good bonding. The composite material had compact structure, no tiny cavities and obvious defects. The average thermal expansion coefficient of SiCp/6063 composites was about 10×10−6~13×10−6 ℃−1 at the temperature range of 20~50 ℃. The thermal conductivity was about 200~220 W/(m•K), which basically met the requirements of the electronic packaging substrate materials. With the increase of temperature, the thermal expansion coefficient of the composite increases first and then drops after transient increase; the thermal expansion coefficient of the composites decreases with the increase of volume fraction; thermal conductivity of SiCp/6063 composites increases significantly after annealing treatment. |
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