李远波,崔志远,郭松名.微细线材微型电阻焊技术研究进展[J].精密成形工程,2020,12(4):55-64.
LI Yuan-bo,CUI Zhi-yuan,GUO Song-ming.Research Progress of Resistance Mircrowelding Technology for Fine and Ultra-fine Wires[J].Journal of Netshape Forming Engineering,2020,12(4):55-64. |
| 微细线材微型电阻焊技术研究进展 |
| Research Progress of Resistance Mircrowelding Technology for Fine and Ultra-fine Wires |
| 投稿时间：2020-06-08 修订日期：2020-07-10 |
| DOI：10.3969/j.issn.1674-6457.2020.04.006 |
| 中文关键词: 微连接 微细线材 微型电阻焊 连接机理 数值仿真 |
| 英文关键词: microjoining fine and ultra-fine wires resistance microwelding bonding mechanism numerical simulation |
| 基金项目:国家自然科学基金（50775046）；广州市重点实验室专项资助（201605030007） |
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| 中文摘要: |
| 随着微机电系统、电子元件、医疗器件不断向小型化和高性能方向发展，微细线材的微型电阻焊工艺应用越来越广泛和重要。从微型电阻焊的原理和主要工艺参数出发，综述了近些年来国内外微细线材微型电阻焊技术的研究状况，重点总结了工艺、连接机理和焊接过程数值仿真方面的研究进展，同时介绍了该技术在电子封装和医疗器械领域的应用。最后展望了该领域未来的主要研究方向和发展前景。微型电阻焊设备的开发、焊接工艺机理的研究、异种金属材料的焊接、焊接仿真模型的构建和焊接过程的质量监控仍是当下及未来的研究热点。 |
| 英文摘要: |
| With the continuous development of micro-electromechanical systems, electronic components, and medical devices in the direction of miniaturization and high performance, the resistance microwelding (RMW) process of fine and ultra-fine wires is more and more widely used and important. In this paper, from the principle and main process parameters of RMW, the research status of RMW for fine and ultra-fine wires at home and abroad in recent years, relating to the RMW process, bonding mechanism, process numerical simulation, were reviewed. The application of this technology in the field of electronic packaging and medical devices was introduced. Finally, special attention was paid to the future trends and prospects of RMW for fine and ultra-fine wires. The future development direction mainly comprises the development of RMW equipment, the study of the welding mechanism, the weldability of dissimilar materials, the simulation of welding process and the quality monitoring of the welding process. |
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