马秋晨,潘浩,张文武,等.面向电子制造的功率超声微纳连接技术进展[J].精密成形工程,2020,12(4):21-36.
MA Qiu-chen,PAN Hao,ZHANG Wen-wu,et al.Progress of Power Ultrasonic Micro-nano Joining Technology for Electronic Manufacturing[J].Journal of Netshape Forming Engineering,2020,12(4):21-36. |
| 面向电子制造的功率超声微纳连接技术进展 |
| Progress of Power Ultrasonic Micro-nano Joining Technology for Electronic Manufacturing |
| 投稿时间：2020-06-01 修订日期：2020-07-10 |
| DOI：10.3969/j.issn.1674-6457.2020.04.003 |
| 中文关键词: 电子封装 超声固相连接 超声复合钎焊 超声纳米连接 高功率器件 |
| 英文关键词: electronic packaging ultrasonic-assisted solid-state bonding ultrasonic-assisted soldering ultrasonic nano-joining high power devices |
| 基金项目:国家自然科学基金（51775140）；广东省重点研发项目（2019B010935001）；广东省自然科学基金（2017A030313302）；深圳市科技创新项目（JCYJ20180507183511908） |
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| 摘要点击次数: 3137 |
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| 中文摘要: |
| 为满足电子制造与封装对新材料与工艺的迫切需求，尤其是高功率、高温服役、高集成度以及高可靠性等新型器件的连接难题，开发了面向电子制造的功率超声微纳连接技术。从固相键合、超声复合钎焊和超声纳米连接3个方面，综述了面向电子制造的功率超声微纳连接技术的原理方法、优势与应用场合。功率超声由于其表面清洁、声流和空化作用，将大幅提升冶金反应速率，有效解决了传统TLP反应温度高时间长，以及Cu和Al等金属的易氧化等问题，甚至攻克了Al2O3，AlN，SiC等陶瓷基板的难润湿以及低温纳米颗粒烧结驱动力不足的难题。综述了该领域多年来的研究成果，聚焦电子制造中的功率超声微纳连接技术，从固相连接领域的引线键合、室温超声金属连接和超声增材制造，到钎焊领域的超声低温软钎焊、超声中高温连接以及超声瞬态液相连接，最后针对第三代半导体高功率器件简述了超声纳米连接，探讨了功率超声微纳连接技术的研究进展及趋势。 |
| 英文摘要: |
| To overcome the urgent need for new materials and processes in microelectronics manufacturing and packaging, especially the joining problems of new devices of high power, high service temperature, high integration and excellent reliability services, a power ultrasonic micro-nano joining technology for electronic manufacturing was developed. The principles, advantages and applications of power ultrasonic micro-nano joining technology for electronic manufacturing were summarized from three aspects of solid-state bonding, ultrasonic composite brazing and ultrasonic nano-joining. Because of effects of surface self-cleaning, acoustic stream and cavitation, power ultrasound significantly accelerated the metallurgical reaction rate, and effectively solved the problem of high temperature and long reaction time of traditional TLP, and oxidation of metals (such as Cu and Al). This technology even overcame the difficulties of wetting of ceramic substrates (such as Al2O3, AlN, and SiC), and the insufficient driving force of low-temperature for nanoparticle sintering. This manuscript summarized the research achievements in this field for many years, focusing on the power ultrasonic micro-nano joining technology. This manuscript discussed the research progress and trend of power ultrasonic micro-nano joining technology, including wire bonding, ultrasonic metal welding at room temperature, ultrasonic additive manufacturing in the field of solid-state bonding, ultrasonic assisted soldering at low, medium, and high temperature, and ultrasonic transient liquid phase in the field of soldering, and ultrasonic nano-joining for third-generation semiconductor high-power devices. |
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