吴鸣,王善林,孙文君,等.回流次数对无铅焊点组织演变及可靠性的影响[J].精密成形工程,2019,11(5):109-114.
WU Ming,WANG Shan-lin,SUN Wen-jun,et al.Effects of Reflux Times on Microstructure Evolution and Reliability of Lead-free Solder Joints[J].Journal of Netshape Forming Engineering,2019,11(5):109-114. |
| 回流次数对无铅焊点组织演变及可靠性的影响 |
| Effects of Reflux Times on Microstructure Evolution and Reliability of Lead-free Solder Joints |
| 投稿时间：2019-07-19 修订日期：2019-09-10 |
| DOI：10.3969/j.issn.1674-6457.2019.05.016 |
| 中文关键词: 无铅焊料 回流次数 金属间化合物 |
| 英文关键词: lead-free solder reflux times intermetallic compound |
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| 中文摘要: |
| 目的 研究不同回流次数对焊点形貌以及组织演变的影响，并通过力学性能来表征不同回流次数下焊点的可靠性。方法 利用置球法将Sn3Ag0.5Cu小球置于Cu基板表面，随后在回流焊机中形成焊点，并进行不同次数回流焊接得到所需焊点，横截镶样打磨腐蚀后，利用光学显微镜、扫描电子显微镜进行显微组织观察，并用推拉试验机进行剪切测试。结果 在焊点反应过程中，由于熔融焊料中析出的过饱和Cu和Sn会在焊料部分形成中空的Cu6Sn5管状物和片状的Sn基体，但随着反应的持续，这些物质逐渐消失。在IMC层的形成过程中，伴随着大量Cu6Sn5颗粒的产生，随着反应的持续，颗粒数量逐渐减少，IMC层厚度逐渐增加，但增加速度减缓。结论 在IMC层的生长过程中，大块IMC会吞噬Cu6Sn5小颗粒来增加自身体积，从而抑制小颗粒的产生，最终减缓自身的生长。此外随着回流次数的增加，焊点由韧性断裂逐渐转变为韧脆性混合断裂，对焊点可靠性的降低具有一定影响。 |
| 英文摘要: |
| This paper aims to study the effects of different reflux times on themorphology and microstructure evolution of solder joints, and to characterize the reliability of solder joints under different reflux times by mechanical properties. Sn3Ag0.5Cu balls were welded on the copper substrate through the ball placement method. The required solder joints were obtained by reflow soldering at different times. The cross section samples were polished and corroded. The microstructures were observed with optical microscopy and scanning electron microscopy, and the shear tests were carried out by push-pull test machine. In the process of solder joint reaction, hollow Cu6Sn5 tubular and flaky Sn matrix were formed in the solder due to the supersaturated Cu and Sn precipitated from the molten solder, but these substances gradually disappeared with the continuous reaction. During the formation of IMC layer, a large number of Cu6Sn5 particles were produced. With the continuous reaction, the number of particles gradually decreased, and the thickness of IMC layer gradually increased, but the increase rate slowed down. During the growth of IMC layer, the bulk IMC can swallow small particles of Cu6Sn5 to increase its volume, thus inhibiting the production of small particles, and ultimately slowing down its growth. In addition, with the increase of reflux times, the toughness fracture of solder joints gradually changes to the mixed toughness-brittleness fracture, which has a certain impact on the reliability of solder joints. |
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