胡新芳,邵明星,韩潇潇,等.硼对纯铜的细化机理研究[J].精密成形工程,2018,10(6):17-21.
HU Xin-fang,SHAO Ming-xing,HAN Xiao-xiao,et al.Boron Refining Mechanism of Pure Copper[J].Journal of Netshape Forming Engineering,2018,10(6):17-21. |
| 硼对纯铜的细化机理研究 |
| Boron Refining Mechanism of Pure Copper |
| 投稿时间：2018-10-10 修订日期：2018-11-10 |
| DOI：10.3969/j.issn.1674-6457.2018.06.003 |
| 中文关键词: 铜合金 晶粒细化 硼 共格 |
| 英文关键词: copper alloy grain refinement boron lattice matching |
| 基金项目:国家自然科学基金（51071097）；山东省自然科学基金（ZR201702200041）；山东大学青年学者未来计划 |
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| 中文摘要: |
| 目的 探究微量硼对纯铜晶粒的影响及机制。方法 利用高倍视频显微镜对细化前后纯铜的铸锭组织进行观察与分析。利用热场发射扫描电子显微镜对细化前后纯铜的样品进行组织和成分分析。利用高分辨透射显微镜对样品进行微观形貌及晶体结构的分析。结果 随着硼含量的增加，纯铜的晶粒明显细化。微量硼在纯铜中以单质形式存在，主要分布于晶界上。结论 硼对纯铜有明显的细化效果，可显著细化纯铜的晶粒，将其晶粒细化至100 μm左右。硼对纯铜晶粒细化的机制主要是限制生长机制，在凝固过程中硼被铜晶粒排斥到晶界处，从而限制了铜晶粒的长大。 |
| 英文摘要: |
| This work is to explore the effect of trace boron on pure copper grain and its mechanism. The microstructure of pure copper ingots before and after refinement was observed and analyzed with high power video microscope. The microstructure and composition of pure copper samples before and after refinement were analyzed by thermal field emission scanning electron microscopy. The morphology and crystal structure of the samples were analyzed by high resolution transmission microscope. With the increase of boron content, the grain of pure copper was obviously refined. Trace boron existed in the form of a single substance in pure copper, mainly distributed on the grain boundary. Boron has obvious refining effect on pure copper, and the grain of pure copper can be refined to about 100 μm. The mechanism of boron refining pure copper grains is mainly the growth restriction mechanism. During solidification, the boron is repelled by copper grains to the grain boundary, thus limiting the growth of copper grains. |
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