文章摘要
舒大禹,景蓉,杨谋,等.Ti8LC合金热处理力学性能的回归分析[J].精密成形工程,2010,2(5):1-5.
SHU Da-yu,JING Rong,YANG Mou,et al.The Regression Analysis of Heat Treatment on Mechanical Properties of Ti8LC Alloy[J].Journal of Netshape Forming Engineering,2010,2(5):1-5.
Ti8LC合金热处理力学性能的回归分析
The Regression Analysis of Heat Treatment on Mechanical Properties of Ti8LC Alloy
投稿时间:2010-05-18  修订日期:2010-09-10
DOI:
中文关键词: Ti8LC合金  回归分析  抗拉强度  显微组织
英文关键词: Ti8LC alloy  regression analysis  tensile strength  microstructure
基金项目:总装备部预研项目(51312050107)
作者单位
舒大禹 1.中国兵器工业第五九研究所重庆 4000392.国防科技工业精密塑性成形技术研究应用中心重庆 400039 
景蓉 中国兵器工业第203所 西安 710065 
杨谋 重庆长安跨越车辆有限公司重庆 400026 
胡传凯 1.中国兵器工业第五九研究所重庆 4000392.国防科技工业精密塑性成形技术研究应用中心重庆 400039 
康凤 1.中国兵器工业第五九研究所重庆 4000392.国防科技工业精密塑性成形技术研究应用中心重庆 400039 
黄树海 1.中国兵器工业第五九研究所重庆 4000392.国防科技工业精密塑性成形技术研究应用中心重庆 400039 
宁海青 1.中国兵器工业第五九研究所重庆 4000392.国防科技工业精密塑性成形技术研究应用中心重庆 400039 
赵祖德 1.中国兵器工业第五九研究所重庆 4000392.国防科技工业精密塑性成形技术研究应用中心重庆 400039 
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中文摘要:
      采用正交试验设计了Ti8LC合金的热处理制度,并测试了不同热处理制度下Ti8LC合金的室温抗拉强度,利用多元回归模型对Ti8LC合金的热处理制度与抗拉强度进行了回归分析,建立了热处理制度与抗拉强度之间的回归方程,通过方差分析验证了该回归方程具有较高的可信度。同时分析了Ti8LC合金抗拉强度与合金相的体积分数及晶粒尺寸的关系,得到了合金室温抗拉强度与合金相的体积分数及晶粒尺寸近似呈线性关系,并从微观组织结构分析了合金相的体积分数、晶粒尺寸与热处理温度、时间之间的关系。
英文摘要:
      Heat treatment system of Ti8LC alloy was designed by use of the method of orthogonal experiment and the tensile strength at room temperature under different heat treatment systems was tested. Furthermore, regression analysis was carried out to the heat treatment and tensile strength of Ti8LC alloy based on multiple regression model and regression equations between heat treatment system and tensile strength were established. The high credibility of regression equations was verified through the analysis of variance. By analysis of the relationship between tensile strength, volume fraction of alloy phase and grain size it was known that the relationship was similar to linear relationship. Besides, the relationship between volume fraction of alloy phase, grain size and temperature, time of heat treatment was established based on microstructure analysis.
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